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METAMATERIAL PIONEER RAYSPAN LICENSEES SHIP 5 MILLION ANTENNAS IN 2008 San Diego, CA – September 8, 2008 – Rayspan Corporation, the world’s leading innovator of metamaterial air interface solutions, is proud to announce that in the first three quarters of 2008 licensees of its technologies have shipped more than 800,000 devices equipped with a total of more than five million metamaterial antennas. The applications supported by these advanced wireless communications products include WiFi wireless LANs, laptop PCs, and cellular phones. Franz Birkner, Rayspan President and CEO, stated that “This rapid growth to extremely high volumes across a broad range of markets establishes the technical and commercial superiority of Rayspan and its unique metamaterial air interface solutions. We are today the only company in the world to have successfully developed and commercialized metamaterials technology for wireless communications, and we intend to maintain this leadership through advanced research and development, constant product innovation and aggressive first-to-market capabilities. Going forward, we will broaden our array of solutions to include not only antennas but also entire RF front-ends offering true superiority in miniaturization, cost effectiveness and performance improvement.” Since its founding in April 2006, Rayspan has focused on innovating and implementing metamaterials technology to solve the fundamental challenges of the wireless communications air interface - an essential part of every radio that includes the antenna and all associated RF front-end components. As standards have proliferated to include 3/4G cellular, WiFi MIMO, GPS, Bluetooth, WiMax and UWB, the air interface now presents some of the most difficult system integration problems facing the wireless industry. Because these standards require support of multiple radio bands and multiple channels within bands, until now the size and spacing requirements of the antennas and RF components have made it nearly impossible to achieve compact mobile terminal size while still achieving wireless performance objectives. Rayspan’s metamaterial air interface solutions decisively solve these problems. They enable ultra-compact, multi-band MIMO wireless terminals with no sacrifice in performance and with excellent cost-effectiveness. In virtually all cases metamaterial air interfaces provide equal or better throughput and efficiency than the conventional air interface components they replace - or eliminate - while offering a much smaller form factor. Metamaterial solutions available from Rayspan today include a broad line of single and multi-band antennas and arrays together with complementary directional couplers, power combiners and power splitters. These solutions address virtually all segments of the billion unit wireless local- and wide-area network equipment markets, and they can be implemented quickly and inexpensively by Rayspan’s licensees. For more information: Franz Birkner |
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