METAMATERIAL PIONEER RAYSPAN FILES FOR REEXAMINATION OF RUCKUS PATENTS

SAN DIEGO, CA – September 8, 2008 - Rayspan Corporation, the world’s leading innovator of metamaterial air interface solutions, requested today that the United States Patent & Trademark Office reexamine two U.S. patents held by Ruckus Wireless, Inc. Rayspan took this action because it discovered a number of prior publications and patents ("prior art") that raise substantial new questions regarding the patentability of the Ruckus patents. The primary references in the prior art identified by Rayspan were not previously considered by the Patent Office when it first issued the patents. Rayspan strongly believes that the patents would not have issued had the patent office been fully informed about this prior art and accordingly has filed formal requests for their reexamination. As an intellectual property enterprise, Rayspan is highly qualified to reach these conclusions and to bring the relevant prior art to the attention of the Patent Office.

The two Ruckus patents at issue, U.S. Patent Nos. 7,193,562 and 7,358,912 are the subject of a lawsuit filed by Ruckus earlier this year in which it alleges that Rayspan infringes these two patents.

"Although Rayspan is certain it does not infringe either Ruckus patent, we felt it was important to bring this prior art to the Patent Office's attention and to make use of the inter partes reexamination procedures that Congress specifically created for situations like this. The reexamination process gives the Patent Office a chance to reconsider its decision to issue these patents in light of the prior art that it did not have available to consider before. It is Rayspan’s belief that upon reexamination, the two Ruckus patents will be found invalid," said Franz Birkner, CEO of Rayspan.

Rayspan’s petitions for reexamination of the Ruckus patents, along with the prior art cited within them, are public documents that the Patent Office makes available through its website.

• Rayspan’s mission is to research, develop and commercialize the world’s leading portfolio of revolutionary new metamaterial air interface technology, enabling its customers to achieve breakthrough improvements in antenna and RF front-end component miniaturization, performance, cost reduction and ease of manufacture.
• Rayspan’s proprietary metamaterial solutions are composite materials engineered to produce unique and highly desirable electromagnetic propagation behavior not found in natural media. Metamaterials is an all-new science that enables unprecedented wireless component and system capabilities.
• Rayspan metamaterial solutions are available for a broad range of fixed and mobile wireless WAN, LAN and PAN applications, including 3G/4G cellular, Wi-Fi, Bluetooth, GPS and WiMAX. These solutions target the needs of virtually all wireless communications OEMs and ODMs.
• Rayspan’s leading portfolio of proprietary metamaterial technology includes over twenty essential enabling patents as well as a complete library of metamaterial designs and a comprehensive array of enabling design tools.

For more information:

Franz Birkner
President & CEO
Rayspan Corporation
franz@rayspan.com
(858) 259-9596 x222

info@rayspan.com